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description the ICX059AK is an interline ccd solid-state image sensor suitable for pal color video cameras. high resolution is achieved through the use of ye, cy, mg, and g complementary color mosaic filters. at the same time, high sensitivity and low dark current are achieved through the adoption of had (hole- accumulation diode) sensors. this chip features a field period readout system and an electronic shutter with variable charge-storage time. features high resolution, high sensitivity and low dark current continuous variable-speed shutter 1/50s (typ.), 1/120s to 1/10000s low smear excellent antiblooming characteristics ye, cy, mg, and g complementary color mosaic filters on chip horizontal register: 5v drive reset gate: 5v drive device structure optical size: 1/3-inch format number of effective pixels: 752 (h) 582 (v) approx. 440k pixels number of total pixels: 795 (h) 596 (v) approx. 470k pixels interline ccd image sensor chip size: 6.00mm (h) 4.96mm (v) unit cell size: 6.50m (h) 6.25m (v) optical black: horizontal (h) direction: front 3 pixels, rear 40 pixels vertical (v) direction: front 12 pixels, rear 2 pixels number of dummy bits: horizontal 22 vertical 1 (even field only) substrate material: silicon ?1 ICX059AK e91y29b5y-ps 1/3-inch ccd image sensor for pal color camera sony reserves the right to change products and specifications without prior notice. this information does not convey any license by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustrating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. aaaaa a aaa a a aaa a aaaaa pin 1 v 3 40 2 12 pin 9 h optical black position (top view) 16 pin dip (plastic)
?2 ICX059AK substrate voltage sub ?gnd supply voltage vertical clock input voltage voltage difference between vertical clock input pins voltage difference between horizontal clock input pins h f 1 , h f 2 ?v f 4 h f 1 , h f 2 , lh f 1 , rg, v gg ?gnd h f 1 , h f 2 , lh f 1 , rg, v gg ?sub v l ?sub v f 1 , v f 2 , v f 3 , v f 4, v dd , v out ?v l rg ?v l v gg , v ss , h f 1 , h f 2 , lh f 1 ?v l storage temperature operating temperature block diagram and pin configuration (top view) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 note) note) :photo sensor v out v ss v gg gnd v f 1 v f 2 v f 3 v f 4 v dd gnd sub v l rg lh f 1 h f 1 h f 2 horizontal register cy ye cy ye mg g mg g cy ye cy ye gmggmg cy ye cy ye mg g mg g vertical register pin no. 1 2 3 4 5 6 7 8 v f 4 v f 3 v f 2 v f 1 gnd v gg v ss v out vertical register transfer clock vertical register transfer clock vertical register transfer clock vertical register transfer clock gnd output amplifier gate bias output amplifier source signal output 9 10 11 12 13 14 15 16 v dd gnd sub v l rg lh f 1 h f 1 h f 2 output amplifier drain supply gnd substrate (overflow drain) protective transistor bias reset gate clock horizontal register final stage transfer clock horizontal register transfer clock horizontal register transfer clock symbol description pin no. description pin description absolute maximum ratings ?.3 to +55 ?.3 to +18 ?5 to +10 ?5 to +20 to +10 to +15 to +17 ?7 to +17 ?0 to +15 ?5 to +10 ?5 to +0.3 ?.3 to +30 ?.3 to +24 ?.3 to +20 ?0 to +80 ?0 to +60 v v v v v v v v v v v v v v ? ? * 1 v dd , v out, v ss ?gnd v dd , v out, v ss ?sub v f 1 , v f 2 , v f 3 , v f 4 ?gnd v f 1 , v f 2 , v f 3 , v f 4 ?sub item ratings unit remarks * 1 +27v (max.) when clock width < 10s, clock duty factor < 0.1%. symbol
?3 ICX059AK bias conditions item output amplifier drain voltage output amplifier gate voltage output amplifier source substrate voltage adjustment range fluctuation range after substrate voltage adjustment reset gate clock voltage adjustment range fluctuation range after reset gate clock voltage adjustment protective transistor bias v dd v gg v ss v sub ? v sub v rgl ? v rgl v l 14.55 3.8 9.0 ? 1.0 ? 15.0 4.2 15.45 4.65 18.5 +3 4.0 +3 v v v % v % ?% * 1 * 1 * 6 symbol min. typ. max. unit remarks dc characteristics item output amplifier drain current input current input current i dd i in1 i in2 5 1 10 ma ? ? * 3 * 4 symbol min. typ. max. unit remarks grounded with 820 resistor * 2 * 1 indications of substrate voltage (v sub ) ?reset gate clock voltage (v rgl ) setting value. the setting values of substrate voltage and reset gate clock voltage are indicated on the back of the image sensor by a special code. adjust substrate voltage (v sub ) and reset gate clock voltage (v rgl ) to the indicated voltage. fluctuation range after adjustment is 3%. v sub code one character indication v rgl code one character indication -- v rgl code v sub code code and optimal setting correspond to each other as follows. 1 v rgl code optimal setting 1.0 1.5 2.0 2.5 3.0 3.5 4.0 2 3 45 6 7 v sub code optimal setting 9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 14.5 15.0 15.5 16.0 16.5 17.0 17.5 18.0 18.5 efg hjkl m np q r s t uvwx y z ?l? ? v rgl = 3.0v v sub = 12.0v * 2 v l setting is the v vl voltage of the vertical transfer clock waveform. * 3 1) current to each pin when 18v is applied to v dd , v out , vss and sub pins, while pins that are not tested are grounded. 2) current to each pin when 20v is applied sequentially to v f 1 , v f 2 , v f 3 and v f 4 pins, while pins that are not tested are grounded. however, 20v is applied to sub pin. 3) current to each pin when 15v is applied sequentially to rg, lh f 1 , h f 1 , h f 2 and v gg pins, while pins that are not tested are grounded. however, 15v is applied to sub pin. 4) current to v l pin when 30v is applied to v f 1 , v f 2 , v f 3 , v f 4 , v dd and v out pins or when, 24v is applied to rg pin or when, 20v is applied to v gg , vss, h f 1 , h f 2 and lh f 1 pins, while v l pin is grounded. however, gnd and sub pins are left open. * 4 current to sub pin when 55v is applied to sub pin, while pins that are not tested are grounded.
?4 ICX059AK clock voltage conditions item readout clock voltage v vt v vh1 , v vh2 v vh3 , v vh4 v vl1 , v vl2 , v vl3 , v vl4 v f v i v vh1 ?v vh2 i v vh3 ?v vh v vh4 ?v vh v vhh v vhl v vlh v vll v f h ,v f lh v hl ,v lhl v f rg v rglh ?v rgll v f sub 14.55 ?.05 ?.2 ?.0 7.8 ?.25 ?.25 4.75 ?.05 4.5 22.5 15.0 0 0 ?.5 8.5 5.0 0 5.0 23.5 15.45 0.05 0.05 ?.0 9.05 0.1 0.1 0.1 0.5 0.5 0.5 0.5 5.25 0.05 5.5 0.8 24.5 v v v v v v v v v v v v v v v v v 1 2 2 2 2 2 2 2 2 2 2 2 3 3 4 4 5 v vh = (v vh1 + v vh2 )/2 v vl = (v vl3 + v vl4 )/2 v f v = v vh n ?v vl n (n = 1 to 4) high-level coupling high-level coupling low-level coupling low-level coupling * 5 * 5 * 6 low-level coupling horizontal transfer clock voltage reset gate clock voltage substrate clock voltage vertical transfer clock voltage symbol min. typ. max. unit waveform diagram remarks * 5 the horizontal final stage transfer clock input pin lh f 1 is connected to the horizontal transfer clock input pin h f 1 . * 6 the reset gate clock voltage need not be adjusted when reset gate clock is driven when the specifications are as given below. in this case, the reset gate clock voltage setting indicated on the back of the image sensor has not significance. item symbol v rgl v f rg min. typ. max. unit waveform diagram ?.2 8.5 0 9.0 0.2 9.5 v v 4 4 remarks reset gate clock voltage
?5 ICX059AK clock equivalent circuit constant item capacitance between vertical transfer clock and gnd c f v1 , c f v3 c f v2 , c f v4 c f v12 , c f v34 c f v23 , c f v41 c f v13 c f v24 c f h1 , c f h2 c f hh c f lh c f rg c f sub r 1 , r 2 , r 3 , r 4 r gnd r f h 1000 560 470 390 180 100 47 51 8 8 270 80 15 15 pf pf pf pf pf pf pf pf pf pf pf capacitance between vertical transfer clocks capacitance between horizontal transfer clock and gnd capacitance between horizontal transfer clocks capacitance between horizontal final stage transfer clock and gnd capacitance between reset gate clock and gnd capacitance between substrate clock and gnd vertical transfer clock series resistor vertical transfer clock ground resistor horizontal transfer clock series resistor symbol min. typ. max. unit remarks r f h r f h h f 2 h f 1 c f h1 c f h2 c f hh v f 1 c f v12 v f 2 v f 4 v f 3 c f v34 c f v23 c f v41 c f v13 c f v24 c f v1 c f v2 c f v4 c f v3 r gnd r 4 r 1 r 3 r 2 vertical transfer clock equivalent circuit horizontal transfer clock equivalent circuit
?6 ICX059AK v vh = (v vh1 + v vh2 )/2 v vl = (v vl3 + v vl4 )/2 v f v = v vh n ?v vl n (n = 1 to 4) v f 1 v f 3 v f 2 v f 4 v vhh v vh v vhl v vhh v vhl v vh1 v vl1 v vlh v vll v vl v vhh v vh3 v vhl v vh v vhh v vhl v vl3 v vl v vll v vlh v vhh v vhh v vh v vhl v vhl v vh2 v vlh v vl2 v vll v vl v vhh v vhh v vhl v vh4 v vhl v vh v vl v vlh v vll v vl4 drive clock waveform conditions (1) readout clock waveform (2) vertical transfer clock waveform ii ii 100% 90% 10% 0% v vt tr twh tf f m 0v f m 2
?7 ICX059AK tr twh tf 90% 10% twl v f h v hl (3) horizontal transfer clock waveform point a twl v f rg v rgh v rgl + 0.5v v rgl 2.5v v rglh rg waveform v rgll lh f 1 waveform twh tr tf (4) reset gate clock waveform v rglh is the maximum value and v rgll is the minimum value of the coupling waveform during the period from point a in the above diagram until the rising edge of rg. in addition, v rgl is the average value of v rglh and v rgll . v rgl = (v rglh + v rgll )/2 assuming v rgh is the minimum value during the interval twh, then: v f rg = v rgh ?v rgl
?8 ICX059AK clock switching characteristics note) because the horizontal final stage transfer clock lh f 1 is connected to the horizontal transfer clock h f 1 , specifications will be the same as h f 1 . item readout clock vertical transfer clock reset gate clock substrate clock v t v f 1 , v f 2 , v f 3 , v f 4 h f 1 , lh f 1 h f 2 h f 1 , lh f 1 h f 2 f rg f sub 2.3 18 21 11 1.5 2.5 24 26 6.41 13 1.8 19.5 19 26 24 6.41 51 0.5 10 10 0.01 0.01 3 17.5 15 0.5 15 0.5 10 10 0.01 0.01 3 250 17.5 15 0.5 ? ns ns ? ns ? during readout * 1 * 2 during drain charge symbol twh min. typ. max. min. typ. max. min. typ. max. min. typ. max. twl tr tf unit remarks * 1 when vertical transfer clock driver cxd1250 is used. * 2 tf 3 tr ?2ns, and the cross-point voltage (v cr ) for the h f 1 ?lh f 1 rising side of the h f 1 ?lh f 1 and h f 2 waveforms must be at least 2.5v. horizontal transfer clock during imaging during parallel-serial conversion item horizontal transfer clock h f 1 ?lh f 1 , h f 2 16 20 ns * 3 symbol two min. typ. max. unit remarks * 3 the overlap period for twh and twl of horizontal transfer clocks h f 1 ?lh f 1 and h f 2 is two. (5) substrate clock waveform 90% 100% 10% 0% v sub tr twh tf f m f m 2 v f sub
?9 ICX059AK image sensor characteristics (ta = 25?) item sensitivity saturation signal smear video signal shading uniformity between video signal channels dark signal dark signal shading flicker y flicker r-y flicker b-y line crawl r line crawl g line crawl b line crawl w lag s ysat sm shy ? sr ? sb ydt ? ydt fy fcr fcb lcr lcg lcb lcw lag 260 540 330 0.009 0.015 20 25 10 10 2 1 2 5 5 3 3 3 3 0.5 mv mv % % % % % mv mv % % % % % % % % 1 2 3 4 4 5 5 6 7 8 8 8 9 9 9 9 10 ta = 60? zone 0, i zone 0 to ii ' ta = 60? ta = 60? symbol min. typ. max. unit measurement method remarks zone definition of video signal shading 6 8 582 (v) 12 12 752 (h) v 10 h 8 h 8 v 10 effective pixel region ignored region zone 0, i zone ii , ii ' measurement system ccd c.d.s lpf1 lpf2 amp ccd signal output y signal output chroma signal output (3db down 6.3mhz) (3db down 1mhz) note) adjust the amplifier gain so that the gain between [ * a] and [ * y] and between [ * a] and [ * c] equal 1. [ * a] [ * y] [ * c] s/h s/h
?10 ICX059AK image sensor characteristics measurement method measurement conditions 1) in the following measurements, the substrate voltage and the reset gate clock voltage are set to the values indicated on the device, and the device drive conditions are at the typical values of the bias and clock voltage conditions. 2) in the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (ob) is used as the reference for the signal output, which is taken as the value of y signal output or chroma signal output of the measurement system. color coding of this image sensor & composition of luminance (y) and chroma (color difference) signals as shown in the left figure, fields are read out. the charge is mixed by pairs such as a1 and a2 in the a field. (pairs such as b in the b field) as a result, the sequence of charges output as signals from the horizontal shift register (hreg) is, for line a1, (g + cy), (mg + ye), (g + cy), and (mg + ye). these signals are processed to form the y signal and chroma (color difference) signal. the y signal is formed by adding adjacent signals, and the chroma signal is formed by subtracting adjacent signals. in other words, the approximation: y = {(g + cy) + (mg + ye)} 1/2 = 1/2 {2b + 3g + 2r} is used for the y signal, and the approximation: r ?y = {(mg + ye) ?(g + cy)} = {2r ?g} is used for the chroma (color difference) signal. for line a2, the signals output from hreg in sequence are (mg + cy), (g + ye), (mg + cy), (g + ye). the y signal is formed from these signals as follows: y = {(g + ye) + (mg + cy)} 1/2 = 1/2 {2b + 3g + 2r} this is balanced since it is formed in the same way as for line a1. in a like manner, the chroma (color difference) signal is approximated as follows: ?(b ?y) = {(g + ye) ?(mg + cy)} = ?{2b ?g} in other words, the chroma signal can be retrieved according to the sequence of lines from r ?y and ?(b ?y) in alternation. this is also true for the b field. cy ye g mg cy ye g mg cy ye g mg cy ye g mg a1 a2 b hreg color coding diagram
?11 ICX059AK definition of standard imaging conditions 1) standard imaging condition i : use a pattern box (luminance 706cd/m 2 , color temperature of 3200k halogen source) as a subject. (pattern for evaluation is not applicable.) use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter and image at f5.6. the luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) standard imaging condition ii : image a light source (color temperature of 3200k) with a uniformity of brightness within 2% at all angles. use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter. the luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. sensitivity set to standard imaging condition i . after selecting the electronic shutter mode with a shutter speed of 1/250s, measure the y signal (ys) at the center of the screen and substitute the value into the following formula. s = ys [mv] 2. saturation signal set to standard imaging condition ii . after adjusting the luminous intensity to 10 times the intensity with average value of the y signal output, 200mv, measure the minimum value of the y signal. 3. smear set to standard imaging condition ii . with the lens diaphragm at f5.6 to f8, adjust the luminous intensity to 500 times the intensity with average value of the y signal output, 200mv. when the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective h blankings, measure the maximum value ysm [mv] of the y signal output and substitute the value into the following formula. 4. video signal shading set to standard imaging condition ii . with the lens diaphragm at f5.6 to f8, adjust the luminous intensity so that the average value of the y signal output is 200mv. then measure the maximum (ymax [mv]) and minimum (ymin [mv]) values of the y signal and substitute the values into the following formula. shy = (ymax ?ymin)/200 100 [%] 5. uniformity between video signal channels set to standard imaging condition ii . adjust the luminous intensity so that the average value of the y signal output is 200mv, and then measure the maximum (crmax, cbmax [mv]) and minimum (crmin, cbmin [mv]) values of the r ?y and b ?y channels of the chroma signal and substitute the values into the following formula. ? sr = | (crmax ?crmin)/200 | 100 [%] ? sb = | (cbmax ?cbmin)/200 | 100 [%] 6. dark signal measure the average value of the y signal output (ydt [mv]) with the device ambient temperature 60? and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. sm = 100 [%] (1/10v method conversion value) 200 ysm 500 1 10 1 50 250
?12 ICX059AK 7. dark signal shading after measuring 6, measure the maximum (ydmax [mv]) and minimum (ydmin [mv]) values of the y signal output and substitute the values into the following formula. ? ydt = ydmax ?ydmin [mv] 8. flicker 1) fy set to standard imaging condition ii . adjust the luminous intensity so that the average value of the y signal output is 200mv, and then measure the difference in the signal level between fields ( ? yf [mv]). then substitute the value into the following formula. fy = ( ? yf/200) 100 [%] 2) fcr, fcb set to standard imaging condition ii . adjust the luminous intensity so that the average value of the y signal output is 200mv, insert an r or b filter, and then measure both the difference in the signal level between fields of the chroma signal ( ? cr, ? cb) as well as the average value of the chroma signal output (car, cab). substitute the values into the following formula. fci = ( ? ci/cai) 100 [%] (i = r, b) 9. line crawls set to standard imaging condition ii . adjust the luminous intensity so that the average value of the y signal output is 200mv, and then insert a white subject and r, g, and b filters and measure the difference between y signal lines for the same field ( ? ylw, ? ylr, ? ylg, ? ylb [mv]). substitute the values into the following formula. lci = ( ? yli/200) 100 [%] (i = w, r, g, b) 10. lag adjust the y signal output value generated by strobe light to 200mv. after setting the strobe light so that it strobes with the following timing, measure the residual signal (ylag). substitute the value into the following formula. lag = (ylag/200) 100 [%] ylag (lag) y signal output 200mv light fld sg1 strobe light timing output
?13 ICX059AK 7 15v 5v xsub xv2 xv1 xsg1 xv3 xsg2 xv4 h f 2 h f 1 rg 50k 100k 1/20v 0.01 ccd out ?.5v 3.3/16v 47/6.3v 820 100 3.9k 2sk523 100k 39k 1/6.3v 1m 0.01 3.3/20v 15k 47k 15k 0.1 39k 0.1 270k 2sc2785 3 27k 56k 0.1 100k 1/35v 1/35v 1/35v 10/20v 22/16v 22/20v 22 /10v cxd1250 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 12 3 45 6 8 16 15 14 13 12 11 10 9 gnd icx059 (bottom view) h f 2 h f 1 lh f 1 rg v l sub gnd v dd v f 4 v f 3 v f 2 v f 1 v gg v ss v out [ * a] drive circuit
?14 ICX059AK spectral sensitivity characteristics (includes lens characteristics, excludes light source characteristics) wave length [nm] 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 relative response 400 600 450 650 500 700 550 cy g mg ye sensor readout clock timing chart unit : s odd field even field hd v1 v2 v3 v4 v1 v2 v3 v4 2.5 2.5 2.5 1.6 0.2 41.6 2.5
?15 ICX059AK fld vd blk hd sg1 sg2 v1 v2 v3 v4 ccd out clp1 620 625 1 2 3 4 5 15 20 25 310 320 335 330 340 581 582 135 246 135 246 582 581 2 1 4 3 6 5 10 315 325 2 1 4 3 6 5 drive timing chart (vertical sync)
?16 ICX059AK 745 750 1 3 5 10 20 30 40 1 2 3 5 10 20 22 1 2 3 1 2 3 10 20 hd blk h1/lh1 h2 rg shp shd v1 v2 v3 v4 clp1 sub 752 drive timing chart (horizontal sync)
?17 ICX059AK notes on handling 1) static charge prevention ccd image sensors are easily damaged by static discharge. before handling be sure to take the following protective measures. a) either handle bare handed or use non-chargeable gloves, clothes or material. also use conductive shoes. b) when handling directly use an earth band. c) install a conductive mat on the floor or working table to prevent the generation of static electricity. d) ionized air is recommended for discharge when handling ccd image sensor. e) for the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) soldering a) make sure the package temperature does not exceed 80?. b) solder dipping in a mounting furnace causes damage to the glass and other defects. use a ground 30w soldering iron and solder each pin in less than 2 seconds. for repairs and remount, cool sufficiently. c) to dismount an image sensor, do not use a solder suction equipment. when using an electric desoldering tool, use a thermal controller of the zero cross on/off type and connect it to ground. 3) dust and dirt protection a) operate in clean environments (around class 1000 is appropriate). b) do not either touch glass plates by hand or have any object come in contact with glass surfaces. should dirt stick to a glass surface, blow it off with an air blower. (for dirt stuck through static electricity ionized air is recommended.) c) clean with a cotton bud and ethyl alcohol if the grease stained. be careful not to scratch the glass. d) keep in a case to protect from dust and dirt. to prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) when a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. do not reuse the tape. 4) do not expose to strong light (sun rays) for long periods, color filters will be discolored. 5) exposure to high temperature or humidity will affect the characteristics. accordingly avoid storage or usage in such conditions. 6) ccd image sensors are precise optical equipment that should not be subject to mechanical shocks.
?18 ICX059AK package outline unit: mm package structure 0.3 16pin dip (450mil) h v 2.5 2.5 8.4 0.5 1.2 5.7 6.1 10.3 12.2 0.1 9.5 11.4 0.1 11.43 0.25 0?to 9 8 1 16 9 2-r0.5 2.5 11.6 9.2 2.5 1.2 3.35 0.15 3.1 1.27 3.5 0.3 0.46 0.3 1.27 0.69 (for the first pin only) 1. ? is the center of the effective image area. 2. the two points ? of the package are the horizontal reference. the point ?' of the package is the vertical reference. 3. the bottom ? of the package, and the top of the cover glass ? are the height reference. 4. the center of the effective image area relative to ? and ?' is (h, v) = (6.1, 5.7) 0.15mm. 5. the rotation angle of the effective image area relative to h and v is 1? 6. the height from the bottom ? to the effective image area is 1.41 0.10mm. the height from the top of the cover glass ? to the effective image area is 1.94 0.15mm. 7. the tilt of the effective image area relative to the bottom ? is less than 50m. the tilt of the effective image area relative to the top ? of the cover glass is less than 50m. 8. the thickness of the cover glass is 0.75mm, and the refractive index is 1.5. 9. the notches on the bottom of the package are used only for directional index, they must not be used for reference of fixing. c b a d m b' ~ ~ ~ package material lead treatment lead material package weight plastic gold plating 42 alloy 0.9g

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